Mobility
Construction
Electronics.

INDAR primer allows to dismantle bonded assemblies upon heat, without sacrificing the product service properties, making possible to reuse or recycle materials of an end-of-life bonded product.
When INDAR primer is coated between an adhesive and a substrate as a thin layer, the assembly has the same properties than the one without the primer, in particular adhesion, climate aging resistance or thermomechanics.
Once the product reaches its end-of-life, the substrate can be easily separated from the adhesive upon heat, thanks to the activation of the INDAR primer layer. 3 main versions exist, with different debonding temperatures:

Once activated, the debonding can be done at cold stage, as the trigger mechanism is irreversible. Residues can be easily cleaned using light alcohol, enabling materials reusing or recycling.
This primer can be used like a standard primer in a fabrication line, deposited in thin layer (~100 µm wet) using well-known coating processes, such as brush coating, spray coating, bar coating or jetting.
